Technology & Innovation Organization Hardware Engineering Internship (May 2026)

Join HP, Inc. for a 12-week paid summer internship focused on developing UEFI/BIOS code and AI model training within the Technology & Innovation Organization.

Your Role

Here’s what you will be doing:

• Develop UEFI/BIOS code on HP Workstations
• Troubleshoot complex technical problems
• Gather training data for AI models
• Work within the Technology & Innovation Organization to deliver AI-driven solutions enhancing customer experiences

About You

The company is looking for:

• Students who have completed their 3rd year of university or 1st year of a master’s program, typically in a technical degree specialization
• Ability to obtain work authorization in the United States in 2026 without requiring future sponsorship
• Preferred majors include Hardware Engineering, Electrical Engineering, Mechanical Engineering, Industrial Design, or related technical fields

Compensation & Benefits

• Hourly pay range of $29 to $35 (US candidates only), varying by location, knowledge, skills, and experience
• Health, dental, and vision insurance
• Long term and short term disability insurance
• Employee assistance program
• Flexible spending account
• Life insurance
• Generous time off policies including 4-12 weeks fully paid parental leave based on tenure, 13 paid holidays, and 15 days paid time off (pro-rated based on hire date and hours worked)

Training & Development

The internship offers a balance of networking, executive speakers, community involvement, and hands-on projects to enhance learning and professional growth.

How to Apply

If you believe this internship matches your knowledge and interests, please apply to share your qualifications and enthusiasm for the role.

This job may close before the stated closing date, you are encouraged to apply as soon as possible

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