Qualcomm

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  • 1,000 - 50,000 employees

Mechanical Engineering Internship (May 2026)

Location details

On-site

  • United States

    United States

    • California

      San Diego

    • Texas

      Austin

Location

San Diego, Austin

Closing in 8 days

Opportunity details

  • Opportunity typeInternship, Clerkship or Placement
  • SalaryUSD 17 - 98 / Hour
  • Application open dateApply by 9 Feb 2026
  • Start dateStart date 1 May 2026 - 31 May 2026

Join Qualcomm as a Mechanical Engineering Intern to design, simulate, and test mechanical and thermal systems supporting advanced semiconductor technologies.

Your Role

Key responsibilities include:

  • Collaborate as an equal contributor with a team of leading engineers
  • Design, simulate, and test mechanical and thermal systems for semiconductor technologies
  • Work on projects involving IC packaging, chip/package co-design, thermal modeling, signal and power integrity, and next-generation cooling solutions
  • Contribute to the Mechanical Engineering track aligned with your skills and resume

About You

The company is looking for candidates who meet the following qualifications:

  • Currently enrolled in a bachelor’s, master’s, or Ph.D. program in mechanical engineering, materials science, or related field
  • Available for 11–14 weeks during Summer 2026 (May–September)
  • Expected graduation date of November 2026 or later
  • 1+ years academic experience with programming languages such as Python or Matlab
  • Preferred: anticipated graduation between November 2026 and June 2027
  • Familiarity with Cadence Sip, AutoCAD, and Solidworks
  • Coursework in Solid Mechanics, Mechanics of Materials, and Finite Element Analysis (FEA)
  • Knowledge of IC packaging structures, chip-package interaction, and electronic packaging processes
  • Experience with thermal system design, modeling, and testing
  • Understanding of heat transfer, mechanical design, and microelectronics
  • Exposure to server product design, system impedance testing, fan performance measurement, and heatsink design methodology
  • Experience with Computational Fluid Dynamics (CFD), wind tunnel, and/or airflow bench operation

Compensation & Benefits

  • Hourly pay range: $17.00 - $98.00
  • Competitive annual discretionary bonus program
  • Opportunity for annual RSU grants (not applicable to sales-incentive plans)
  • Highly competitive benefits package supporting work, home, and play
  • Relocation coverage and furnished housing accommodations for the internship duration

Training & Development

Interns receive mentorship, manager support, and access to Qualcomm’s employee community. The program includes professional development workshops, social events, cross-functional speaker sessions, and an executive speaker series.

How to Apply

By applying, candidates express interest in Qualcomm’s 2026 Mechanical Engineering internships. Resumes are reviewed on an ongoing basis, and recruiters may reach out to qualified applicants. Note that this is not a posting for a specific role.

This job may close before the stated closing date, you are encouraged to apply as soon as possible

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Work rights

The opportunity is available to applicants in any of the following categories.

Work right - United States
United States
US CitizenUS Permanent ResidentUS Student Visa

Qualifications & other requirements

You should have or be completing the following to apply for this opportunity.

Degree or Certificate
Qualification level
Qualification level
Bachelor or higher
Study field
Study field (any)
Engineering & Mathematics
  • Materials Engineering
  • Mechanical Engineering

Hiring criteria

  • Experience requirementNo experience required
  • Working rights
    US Citizen
  • Study fields
    Engineering & Mathematics
  • Degree typesBachelor or higher
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About the employer

logo-qualcomm-450x450-2022.

Qualcomm USA

Number of employees

1,000 - 50,000 employees

Industries

R&D and Manufacturing

A world-leading innovator that looks to inspire the seamless application of technology around the globe.